Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Engineering What’s Next: A Companion Guide to Qnity’s Advanced Electronics Podcast Series, a new publication that expands on the insights shared in the six-part podcast series, On the Line with… Qnity: Engineering What’s Next. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This new companion guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

Trouble in your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

Optivolt Raises $32M to Build the Brain for Solar Panels of the Future

10/22/2026 | BUSINESS WIRE
Optivolt, a power electronics company building the intelligence layer for solar, announced a $32M Series A led by VXI Capital, a new hard tech fund founded by the former CTO of the Defense Innovation Unit of the U.S. Military, with participation from RA Capital, Valo Ventures, and Atlas Innovate. This round brings Optivolt's total capital raised to date to $42M.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in