Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

Estimated reading time: 2 minutes

I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.

For decades, these three concepts have often been treated as interchangeable. Neves explains why they are fundamentally different, why each requires its own testing strategy, and why assembly process survivability should be validated before meaningful reliability testing begins. The book also examines the limitations of traditional techniques such as microsection analysis and daisy chain testing before introducing performance-based assessment methods that detect failures as they develop. Readers gain practical insight into real-time electrical monitoring, the HATS² test system, and single via structure testing, learning how these approaches improve statistical confidence while revealing failure mechanisms that conventional methods often miss.

Dennis Fritz of Fritz Consulting praised the book for bringing clarity to a complex subject, saying it "nicely separates Process Survivability, Reliability, and Robustness," while explaining the strengths and limitations of current reliability test methods. He called it "an essential resource" for engineers seeking a deeper understanding of the factors that influence long-term microvia performance and PCB quality.

Neves is chair and CTO of Reliability Assessment Solutions Inc. (RAS), manufacturer of the HATS² reliability test system, and founder of Microtek Laboratories. A recognized leader in the electronics industry, he is a past chair of the Global Electronics Association Board of Directors and a member of its Hall of Fame. He has authored dozens of technical papers and articles on reliability, testing, and failure analysis, and has spent decades advancing reliability engineering through standards development, technical education, and consulting.

The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness is available now through the I-Connect007 technical library. Printed copies are also available to order here.