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SEMI, TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database

07/08/2026 | SEMI
SEMI and TechSearch International announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Silex Establishes U.S. Manufacturing Capacity – Acquires Semiconductor Fab in Pennsylvania

07/07/2026 | Silex Microsystems
Silex Microsystems has entered into a definitive agreement to acquire a 200 mm integrated circuit fab in Pennsylvania, USA, from Semiconductor Components Industries, LLC.

Asahi Kasei Expands SUNFORT for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Asahi Kasei, a diversified global company, constructed a new slitting facility for SUNFORT™ dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, on July 3. Commercial operations are scheduled to commence this month.

onsemi Advances Fab Right Strategy with Agreements to Divest Two Manufacturing Facilities

07/07/2026 | Globe Newswire
onsemi announced it has entered into definitive agreements to divest two manufacturing facilities.
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