Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

The Test Connection Earns 2026 PCBAA Outstanding Contributor Award

06/18/2026 | The Test Connection Inc.
The Test Connection, Inc., a provider of electronic test and manufacturing solutions, has been recognized by the Printed Circuit Board Association of America (PCBAA) as a recipient of a 2026 Outstanding Contributor Award.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.

SIA Applauds CHIPS Act Incentives for Coherent

06/18/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding manufacturing incentives announced by the Commerce Department and Coherent to support the expansion of Coherent’s indium phosphide manufacturing facility in Sherman, Texas.

Scanfil Mysłowice Expands Measurement Capabilities with New 3D Scanning Technology

06/18/2026 | Scanfil
Scanfil Mysłowice has strengthened its measurement capabilities by introducing a new 3D measurement solution, the Creaform HandySCAN 3D scanner.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in