Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working
Beyond Design: How Signals Survive the Hostile PCB Environment
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.
In a featured article, Michael Previti of MacDermid Alpha Electronics Solutions explores the role of getters in hermetic packaging. While hermetic seals protect sensitive components from external environments, gases such as moisture, hydrogen, carbon dioxide, and organic vapors can remain trapped inside or develop over time from internal materials. Previti explains how properly selected getters create a controlled sink for these contaminants, helping stabilize package environments, improve long-term reliability, and reduce costly field failures in medical, aerospace, telecommunications, photonics, and industrial applications.
Another feature takes readers into one of advanced packaging’s most pressing challenges: thermal management. In an interview with Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, Dr. Shakouri discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex 3D packages. As AI-driven computing continues to increase power densities, thermal characterization has become essential for ensuring reliability, performance, and manufacturability across advanced semiconductor architectures.
The issue also highlights key insights from the APEX EXPO Technical Conference Special Session on Microelectronics Packaging for Aerospace, Defense, and Automotive. Marcy LaRont provides an overview of presentations that examined how advanced packaging has evolved from a supporting technology into a primary system enabler for high-reliability markets. Speakers addressed the growing importance of materials selection, design strategies, and manufacturing approaches required to meet increasingly demanding performance and environmental requirements.
Rounding out the issue is a thought-provoking feature, “From Nanometers to 10-Gauge: It’s More Than Just a Wire,” by Chandra Gupta of Remtec, which explores the connections between advanced semiconductor interconnects and the broader electrical infrastructure that supports modern technology. The article offers a unique perspective on how packaging innovations influence, and are influenced by, the larger systems that power today’s connected world.
Together, these features provide valuable insight into the technologies, materials, and engineering challenges driving the next generation of advanced electronic systems.
Substack subscribers will receive early access to the issue on June 12, with distribution to the full subscriber audience beginning June 15.
Don’t miss this upcoming issue of Advanced Electronics Packaging Digest for timely perspectives on reliability, thermal management, and the evolving landscape of advanced packaging. If you haven't already, subscribe now.
