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American Made Advocacy: Five Years of Educating, Advocating, and Influencing Legislation and Policy

05/26/2026 | Shane Whiteside -- Column: American Made Advocacy
Five years ago, five companies decided that the PCB industry needed its own voice in Washington. The Printed Circuit Board Association of America was created largely in response to the fact that PCBs were not included in the CHIPS Act legislation.

New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing

05/21/2026 | PCBAA
The Printed Circuit Board Association of America celebrates the introduction of a crucial bill that will pave the way to reshore and restore America’s printed circuit board (PCB) industry. Over the past 30 years U.S. share of the world supply of PCBs shrunk from 30 percent to 4 percent because of offshoring. Congress is offering legislative solutions to reverse this trend.

From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

05/06/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.

Vern Solberg: A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment

04/29/2026 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
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