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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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TSMC to Sell 8.1% of Vanguard International Semiconductor
May 15, 2026 | TSMCEstimated reading time: 1 minute
TSMC plans to execute the sale of up to 152.0 million common shares of Vanguard International Semiconductor Corporation (VIS), or approximately 8.1% of VIS’ fully-diluted paid-in capital, through a block trade to financial institutional investors.
The proposed share sale will not affect TSMC’s strategic relations with VIS, including outsourcing of interposer production and licensing of GaN technology to VIS. The proposed share sale is part of TSMC’s plan to focus its resources on core business activities. In June 2024, TSMC ceased to have representation on VIS’ board of directors.
TSMC currently holds approximately 27.1% of VIS shares on a fully diluted basis. Upon the completion of this share sale, TSMC expects to reduce its shareholding in VIS to approximately 19%. TSMC has no plan to sell more VIS shares in the foreseeable future.
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Renesas Completes Acquisition of Irida Labs
05/07/2026 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specializing in embedded software for AI-powered visual perception systems.
STMicroelectronics Enables Always-On Vision with Ultralow-Power Image Sensors
05/01/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy.
Camtek Acquires Visual Layer to Strengthen Visual AI Capabilities in Inspection and Metrology
04/21/2026 | CamtekCamtek Ltd., a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
Wire Harness Taking a Step in the Right Direction
04/08/2026 | Nolan Johnson, SMT007 MagazineTo fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.
An Update on the Omnibus on Sustainability Reporting
04/01/2026 | Diana Radovan, Global Electronics AssociationThe European Commission (EC) released its Omnibus on Sustainability Reporting Proposal on Feb. 26, 2025, as part of its agenda to simplify EU sustainability legislation and reduce administrative burdens for companies while safeguarding the objectives of the EU Green Deal, including content and a timeline proposal. The initial “content” proposal amended key content-related provisions of the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), and the EU Taxonomy (EUT) Regulation.