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Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.

I-Connect007 Welcomes Newest Columnist, Echo Yang of Archer Circuits

10/12/2026 | I-Connect007
I-Connect007 is excited to welcome Echo Yang, founder and president of Archer Circuits, as its newest columnist. As a female owner of a large Asian PCB company, Echo brings her candid, energetic, and practical view of the global PCB business to her column, The Fearless Connector. She will address the differences between Chinese and North American manufacturing, her own struggles to start a business, and some details about DFM, engineering, Gerber files, and the risks of treating RF, rigid-flex, and other demanding products like ordinary FR-4 work. She approaches it all with her own youthful, entrepreneurial spirit.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Connect the Dots: Getting the PCB Quote Right

09/30/2026 | Matt Stevenson -- Column: Connect the Dots
Once the PCB design moves from the designer’s hands to the fabricator, the quote process becomes much more than a matter of price. It’s where we determine what it will take to build your board successfully, from materials and capabilities to cost and production requirements. The more closely designers and fabricators work together during this stage, the better the opportunity to identify potential problems before they reach production.
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