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A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'

04/23/2026 | I-Connect007 Editorial Team
I-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time With… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.

Target Condition: When Design Outpaces Manufacturing

04/23/2026 | Kelly Dack -- Column: Target Condition
Most PCB designers already understand why design for manufacturing (DFM) matters. If a product can’t be built reliably, repeatedly, and at a price anyone will actually pay, it’s dead on arrival. You may have the most elegant schematic and layout ever drawn in a CAD tool, but if the PCB suppliers can’t make it, or the EMS sources refuse to quote it, you may well be considered more of a Nutty Professor or well-meaning inventor than a PCB designer.

AGC's Advanced PCB Material Solutions

04/17/2026 | Real Time with... APEX EXPO
AGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.

What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience

04/16/2026 | I-Connect007 Editorial Team
I-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.

Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS

04/15/2026 | Indium Corporation
Indium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
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