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Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner

04/22/2026 | PRNewswire
Mitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).

STI Electronics Announces New Recipients of the Jim D. Raby/STI Scholarship

04/22/2026 | STI Electronics Inc.
STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, is proud to announce the latest recipients of the Jim D. Raby/STI Scholarship: Ashley Brito, Process Control Technology; June-Ann C. Richards-Owens, Advanced Manufacturing; and Jayden Deon Jones.

Technica Announces Tech Day Event Dates and Agenda

04/13/2026 | Technica USA
Technica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.

IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities

04/10/2026 | Circuit Technology Center, Inc.
Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
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