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I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
May 13, 2026 | I-Connect007Estimated reading time: 1 minute
The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
In “Rethinking Reinforcement Materials for Advanced Packaging: Thermal, Frequency, and Supply Chain Pressures,” Felixiramics’ Ivana Ivanovic examines how reinforcement materials are evolving from a background consideration into a key factor in performance, reliability, and supply chain resilience.
In “System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor,” Marvell Technology Principal Engineer Chetan Patil explains how advanced packaging is redefining system architecture through heterogeneous chiplet assemblies and package-level interconnects.
The issue also includes an exclusive interview with Intel Fellow Dr. Ravi Mahajan, a keynote speaker at APEX EXPO. In “What Heterogeneous Integration Means for EMS Providers,” Mahajan discusses how heterogeneous integration is reshaping system design and why advanced packaging has become central to the industry’s future roadmap.
Together, these features examine the technologies, materials, and architectural shifts driving the next generation of electronics manufacturing and advanced system integration. This issue will be delivered to subscribers on May 18.
To receive the upcoming issue of Advanced Electronics Packaging Digest directly to your inbox, subscribe today.
I-Connect007 Substack subscribers will get early access to AEPD on May 15, 2026. To get your advance issue, subscribe here!
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What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
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