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Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.
As exhibitors, Technica USA joined colleagues Janus Leenders, Specialty Films and Foils Product Manager and Scott Ansbaugh, Sales Manager-North America of Agfa, and other industry leaders from around the world to present innovative materials, equipment, services, and technologies that are helping reshape the future of electronics, making it printed, additive, sustainable, flexible, wearable, textile-based, and 3D.
The international TechBlick event attracted more than 500 attendees, including university students, professors, manufacturers, researchers, and industry experts. Recognized as North America’s premier conference and exhibition for advanced electronics manufacturing, the event focused on the latest developments in additive electronics, printed electronics, hybrid electronics, 3D electronics, sustainable electronics, soft electronics, wearable and textile electronics, flexible and stretchable electronics, and formed and roll-to-roll (R2R) electronics.
Najib Khan, Product Manager at Technica USA, commented: “There is no question that each year this event demonstrates the growing momentum within the advanced electronics market, both through increased attendance and the depth of technical content presented. The conference brings together peers from industry, academia, government, and the defense industrial base from around the world. It is especially rewarding to see technologies that have been developed and validated over the years finding their way into products we use and encounter every day.”
The event provided Technica USA and Agfa with an opportunity to highlight the ORGACON® PEDOT:PSS coatings and inks portfolio, which delivers solutions for applications including antistatic coatings, automotive systems, displays and electro-optics, photovoltaics, sensors, and switches.
Technica USA also attended the NextFlex Innovation Day 2026, held the day prior to the TechBlick conference and exhibition. Frank Medina, Vice Chairman of Technica USA, stated, “NextFlex Innovation Day 2026 brought together the nation’s hybrid electronics ecosystem and demonstrated how emerging technologies are being accelerated into field-ready, manufacturable solutions that support both defense and commercial applications.”
NextFlex continues to address the need for a stronger U.S. electronics manufacturing base through three strategic initiatives: expanding the electronics manufacturing industrial base, providing pilot-scale manufacturing and commercialization pathways, and developing the skilled workforce needed for the future of advanced manufacturing.
Medina concluded, “We were pleased to participate in both events and look forward to working with our colleagues to continue to bring solutions that advance the manufacturing of electronic products.”
