Elementary, Mr. Watson: The Design Matrix: Revealing the Hidden Truths of Reality
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
April 21, 2026 | Koh Young AmericaEstimated reading time: 2 minutes
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
A Proven Platform. A New Frontier.
Koh Young's True3D™ technology didn't become the global standard in electronics manufacturing inspection by accident. It earned that position by delivering measurement accuracy, process intelligence, and yield improvements that manufacturers could measure and depend on. Now, that same platform is being applied to the complexity of advanced packaging, including heterogeneous integration, wafer-level packaging, and semiconductor inspection, where the margin for error is even smaller and the cost of failure even greater.
As the exclusive sponsor of the ECTC Gala, Koh Young is making a clear statement: this community matters, and we are here for the long term. The 2026 technical program spans assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and semiconductor inspection, reflecting exactly the challenges our solutions are engineered to address.
See It for Yourself at Booth 208
Talk is cheap. At Booth 208, Koh Young's specialists will show, not just tell, how AI-powered 3D inspection is solving real problems in advanced packaging production. See how True3D™ measurement and automated process control help manufacturers improve quality, reduce waste, and build toward zero-defect production. If you're wrestling with yield loss, process drift, or inspection gaps in your advanced packaging line, this is a conversation worth having.
Making the Case for a New Standard
"Advanced packaging is pushing the boundaries of what inspection and metrology have traditionally been asked to do," said Joel Scutchfield, General Manager of Surface Mount & Advanced Packaging Operations at Koh Young America. "We built the inspection standard in SMT by delivering measurement accuracy and process intelligence that manufacturers could actually depend on. Now we're bringing that same rigor and commitment to zero-defect manufacturing to advanced packaging. ECTC 2026 is where we make that case directly to the engineers and decision-makers who need it most."
Join the Conversation
Register for ECTC 2026 and make Booth 208 a priority stop. To learn more about Koh Young's inspection solutions for advanced packaging and semiconductor applications, visit www.kohyoungamerica.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.