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Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.

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Managing DDR4, DDR5, and HBM Supply Challenges

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An Active, Growing PCB Industry Tilts Toward High-Complexity Leaders

05/21/2026 | Mike Carano and Thiago Guimaraes, Global Electronics Association
Recent PCB market conditions point to an industry that is active and still expanding in important segments. Demand tied to AI infrastructure, servers, high-layer-count multilayer boards, HDI, ADAS, and defense-related programs remains an important driver of the market. These segments are helping sustain momentum even as conditions in other areas remain more mixed. The result is not a uniformly rising market, but one in which enough high-value activity is flowing through to keep much of the industry on a solid footing.
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