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Suggested Items

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.

The Chemical Connection: Back to Basic Cupric Chloride Etching

07/08/2026 | Don Ball -- Column: The Chemical Connection
We have received several calls in the past few months from younger process people who have been thrust into more senior process positions as their older colleagues retire. They’ve realized they lack the practical knowledge their predecessors have accumulated over the years. They know what their various process parameters are, but not why those particular parameters were in place. I found that the most frequently asked questions have been about cupric chloride etch chemistries. Therefore, I will cover the very basics of cupric chloride etching; not so much the technical facts but why we give the advice we do.

Chemcut Delivers XLi Ferric Chloride Etch System to Texas Nameplate

06/30/2026 | Chemcut Corporation
Chemcut Corporation, the leading U.S. manufacturer of wet processing equipment, is proud to announce the successful delivery and installation of a state-of-the-art XLI Ferric Chloride Etch system to Texas Nameplate Company (TNC) in Lancaster, Texas.

Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.
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