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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Summit Interconnect Marks 10 Years of Precision Manufacturing
April 3, 2026 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect, the largest privately held printed circuit board (PCB) manufacturer in North America, marks its tenth anniversary, a milestone that reflects a decade of bold acquisitions, pioneering technology investments, and an enduring mission: to enable customer success through the highest-reliability PCB manufacturing on the continent. From its founding in April 2016 with two strategic acquisitions to its current network of seven manufacturing facilities across the United States and Canada, Summit has grown from a vision rooted in quality and partnership into a cornerstone of the North American defense and advanced electronics supply chain.
Summit’s story is one of purposeful expansion. Founded by the acquisitions of KCA Electronics (Summit Anaheim) and Marcel Electronics International (Summit Orange), the company grew with intention, bringing in teams that shared its standards for quality and commitment to customer success. Subsequent acquisitions, including Streamline Circuits (Summit Santa Clara), ITL Circuits (Summit Toronto), Eagle Electronics (Summit Chicago), Royal Circuit Solutions (Summit Hollister), and Advanced Assembly (Summit Denver) diversified Summit’s capabilities, deepened its geographic footprint, and solidified its position as a leading North American PCB manufacturer.
Today, Summit employs more than 1,200 professionals across its network, including over 90 engineers and 100 quality team members, led by an executive team with more than 230 combined years of industry leadership experience. The company holds some of the most rigorous certifications in the industry and manufactures a broad range of advanced PCB solutions including HDI rigid, rigid-flex, RF/microwave, and thermal management boards. Summit was named to the Inc. 5000 list of America’s Fastest-Growing Private Companies for three consecutive years, 2021 to 2023, reflecting the company’s sustained growth.
“Ten years ago, we set out to build something different; a company that would earn the trust of the most demanding customers in the world by delivering an unmatched combination of technical depth, responsiveness, and operational discipline. What we have built over the past ten years reflects the dedication of our people and the trust of our customers. At Summit, we hold ourselves to the highest standards because the work our customers do demands nothing less. That commitment is what has driven our growth, and it is what will continue to define us going forward,” said Shane Whiteside, President & CEO.
Summit Interconnect’s commitment to industry leadership extends beyond its manufacturing operations. That dedication to the broader industry was recognized in 2024, when Summit was presented with the Peter Sarmanian Corporate Recognition Award, IPC’s highest corporate honor for a company in the printed circuit board industry. More than 115 Summit staff members hold IPC certifications, reflecting the company’s deep commitment to industry standards and workforce development. Also, as a founding member of the Printed Circuit Board Association of America (PCBAA), Summit has worked alongside policymakers and fellow manufacturers to advance legislation critical to U.S. electronics.
As the demand for domestic, high-reliability PCB manufacturing continues to grow, driven by the needs of defense, aerospace, and advanced technology markets, Summit Interconnect is uniquely positioned for the decade ahead. Guided by our core values of expertise, reliability, transparency, and environmental stewardship, Summit Interconnect enters its second decade with the same drive and determination that has defined us from day one.
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My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/27/2026 | Marcy LaRont, I-Connect007 MagazineIt’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!
Growing an Engineer: Meet Emerging Engineer Julian Vega
02/25/2026 | Marcy LaRont, I-Connect007 MagazineJulian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit
02/23/2026 | SiemensSiemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR
01/23/2026 | SEMIThe FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging.