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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech, offering process chemicals, equipment, software and services, and ESI, offering (laser systems, will showcase advanced printed circuit board and package substrate manufacturing technologies atThailand Electronics Circuit Asia (THECA) 2026, taking place August 26–28, 2026, at the Bangkok International Trade & Exhibition Centre (BITEC) in Bangkok, Thailand.
During the conference, MKS experts will present two technical presentations addressing closed-loop digital process control and the evolving PCB technology requirements of AI, high-performance computing and data center infrastructure.
As artificial intelligence (AI), high-performance computing (HPC) and data center applications continue to drive demand for increasingly complex printed circuit boards and package substrates, manufacturers must improve process control, production efficiency and product performance while reducing resource consumption.
At THECA 2026, visitors can meet MKS experts at booth L01 in halls EH 98–99 and learn how an integrated portfolio of process chemistry, equipment, laser technologies, and digital process management can help address manufacturing challenges across the PCB production workflow. “Electronics manufacturers are navigating an unprecedented combination of performance, quality and sustainability requirements,” said Sujaree Kaewgun, Sales Director Electronics and Managing Director Thailand. “Through our integrated technology portfolio and deep process expertise, we help customers optimize manufacturing, accelerate innovation and prepare for the next generation of AI-driven electronics.”
Through its MKS Academy initiative, the company shares technical expertise and best practices with customers and industry professionals worldwide. The presentations form part of MKS’ broader commitment to sharing technical expertise and supporting capability development across the electronics manufacturing industry.
Closed-Loop IIoT Control for a Green and Intelligent PCB Factory: A Data-Driven Approach Integrating Domain Expertise
Giovanni Obino will discuss how the MKS Digital Factory Suite enables closed-loop IIoT control by combining real-time process monitoring, advanced analytics, and process expertise to improve stability, optimize resources, and support smarter factory operations.
PCB Technology Evolution – Building Next-Generation AI, HPC and Datacenter Infrastructure
This presentation examines the evolving technology requirements for AI, high-performance computing and data center applications. It discusses emerging PCB and package substrate architectures, advanced interconnect technologies and manufacturing innovations required to support higher signal integrity, increased power density and next-generation computing performance.
Technology Highlights
MKS will feature a broad range of advanced process and equipment solutions, including:
Atotech process chemistry
- Printoganth® P2: Advanced horizontal electroless copper process offering superior throw into blind microvias and nano-void-free deposits for high-frequency and flexible applications.
- Inpulse® 2HF9: Horizontal pulse-plating process for reliable blind-microvia filling in high-volume HDI and Anylayer production, with minimum surface-plated copper.
- NovaBond® PX-S2: Ultra-low-roughness adhesion promoter combining selective nano-roughening with chemical bonding to preserve trace geometry and support signal integrity, thermal reliability and bonding strength.
- Aurotech® G-Bond 3: Versatile gold electrolyte for ENIG, ENEPIG and EPAG finishes, offering high bath stability and non-toxic stabilization without KCN replenishment.
- StannoPure® PF10: High-speed pure-tin plating process for connectors, leadframes and wires, providing excellent coverage across the current-density range and using an additive system free of PFAS, NPE and BPA.
Atotech Equipment solutions include:
- G-Plate®: Vertical desmear and electroless-copper high-volume manufacturing (HVM) plating tool for next-generation high-end package substrates with optimized particle control
- vPlate®: Vertical conveyorized plating equipment for next-generation
- HDI PCB and package substrates
Laser Platforms (ESI Products)
- Capstone™: Flex PCB UV drilling tool for high-performance breakthrough productivity.
- Geode™ platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
Visitors are invited to attend the technical presentations and meet MKS experts at booth L01 to discuss developments in PCB and package substrate manufacturing, digital process control and advanced interconnect technologies.
Event Details
Conference: THECA 2026
Date: August 26-28, 2026
Booth: L01 in Hall EH 98-99
Venue: BITEC, Bangkok
