-
-
News
News Highlights
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
SMTA's Electronics in Harsh Environments Conference Program Announced
March 27, 2026 | SMTAEstimated reading time: 1 minute
SMTA is proud to announce the 2026 Electronics in Harsh Environments Conference, taking place 19-21 May in Amsterdam, Netherlands. This global conference is a three-day technical event with 25 technical presentations focused on building reliable electronics used in power electronics and harsh environments.
Session Topics Include:
- Harsh Environmental Conditions, Failure Mechanisms & Design for Reliability
- Coating Selection & Testing
- Humid Environmental Conditions: Testing & Simulation
- Isolation Coordination & Particle Risk Assessment
- High Voltage Stress Conditions
- Test Methods & Cleanliness Validation
- Advanced Materials and Processes
The opening keynote speaker, Vivien Grau, Ph.D., Robert Bosch GmbH, will present “Basics and Mechanisms of Insulation - Influencing Factors on the Lifetime of Electrical Insulation Systems” on Tuesday, 19 May.
Following the keynote, a two-part professional development course will be led by Adrian Kandziora of Volkswagen and David Dudek of Trainalytics. The first session, “Robustness Assessment of Electronic Assemblies via a Newly Developed Condensation Test,” will be followed by the second session, “Beyond the VW Condensation Test – Material and Process Qualification in Accordance with IPC 9202 and IPC 9203”.
Technical presentations will be delivered by leading organizations, including Fraunhofer Institute, Thales Group, ZESTRON Corporation, National Physical Laboratory, Inventec Performance Chemicals, MacDermid Alpha Electronics Solutions, and Indium Corporation, among others.
Registration is available online with early registration pricing in effect until 17 April 2026.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.
Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
IMI Reports Q1 2026 Results, Delivering Higher Profitability and Stable YoY Revenue
05/11/2026 | IMIIntegrated Micro-Electronics, Inc. (IMI), a global electronics manufacturing services provider, announced financial results of the first quarter of 2026 highlighting improved profitability and margin expansion, underscoring the effectiveness of its ongoing transformation initiatives despite pockets of market softness in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.