-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
RFMW, Powerex Sign Distribution Deal for High-Power Mission-Critical Semiconductors
March 24, 2026 | BUSINESS WIREEstimated reading time: 1 minute
RFMW, a Division of Exponential Technology Group, Inc., a premier distributor of RF, microwave, and power management and conversion components, announced a new distribution agreement with Powerex Inc., a leading supplier of discrete devices, modules, and integrated high-power semiconductor solutions. This partnership expands RFMW’s portfolio with Powerex’s extensive range of rectifiers, thyristors, IGBTs, SiC modules, and custom power assemblies designed for demanding high-power applications.
The Powerex portfolio includes rectifiers, SCRs, and thyristors with voltage ratings up to 11 kV and current capabilities up to 8,000A, as well as IGBT and HVIGBT modules rated up to 6.5 kV and 1200A. The company also offers SiC MOSFET modules up to 10 kV / 15 kV and 900A, Si/SiC hybrid modules up to 1.2 kV and 400A, and gate drivers for both IGBT and SiC modules. In addition, Powerex supports custom module development and integrated power assemblies backed by extensive reliability testing and design capabilities, including electrical and burn-in testing, environmental and mechanical validation, 3D CAD modeling, thermal analysis, and simulation.
Powerex solutions serve a wide range of industries, including military and defense, aviation, traction and transportation, motor control, medical power systems, uninterruptible power supplies, welding, induction heating, and renewable energy.
“Powerex fills an important gap in our product portfolio for high-power semiconductor solutions,” said Joel Levine, President of RFMW. “Their long history of reliable performance in mission critical applications and their vertically integrated U.S. manufacturing capability make them a strong addition to our supplier lineup. Powerex products align well with RFMW’s block diagram strategy and complement many of the power solutions already available through our line card.”
Under this agreement, RFMW will promote and distribute Powerex standard and custom power semiconductor solutions, providing customers with access to advanced high-power devices supported by RFMW’s technically driven global sales organization.
Ron Yurko, COO at Powerex, also commented on the partnership: “We are pleased to partner with RFMW to expand the availability of our high-power semiconductor technologies. RFMW’s strong presence in RF and power electronics markets, combined with their technical sales expertise, will help bring our solutions to a broader range of engineers designing next-generation high-power systems.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission
04/21/2026 | InfineonNASA's Artemis II mission has successfully returned to Earth after ten days in space, having approached the Moon and reached the farthest distance from our planet ever achieved by crewed spaceflight.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Global AI Optical Transceiver Market to Reach US$26 Billion in 2026
04/20/2026 | TrendForceTrendForce’s latest research indicates that the global market for AI-focused optical transceivers has entered a phase of rapid growth, with market size projected to expand from US$16.5 billion in 2025 to $26 billion in 2026, representing over 57% YoY growth.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.