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Beyond Design: How Signals Survive the Hostile PCB Environment

06/03/2026 | Barry Olney -- Column: Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system. Successful design isn’t about routing signals anymore; it’s about engineering transmission lines, preserving uninterrupted return‑current paths, and controlling the resonant structures that naturally form within the multilayer PCB.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.

Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.

Marcy’s Musings: Additive Processes, Signal Consequences

05/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Signal integrity and additive manufacturing, particularly in metallization, are defining themes in modern PCB design and fabrication. PCB layouts are meticulously engineered systems designed to meet strict electrical and power performance targets. However, achieving those targets does not end at the design stage. Once a design enters fabrication, metallization processes—the precise plating of conductive traces—play a critical role in ensuring that signal speed, reliability, and integrity are achieved in the final physical board.
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