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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
March 9, 2026 | AdvancedPCBEstimated reading time: 2 minutes
AdvancedPCB announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly four decades of experience spanning design, materials, manufacturing, engineering, quality, sales, and assembly.
Stine most recently served as Executive Vice President of Aerospace & Defense Strategic Business Development. Since joining AdvancedPCB, he has played a key role in advancing the company’s technical capabilities and supporting customers in some of the industry’s most demanding sectors. Prior to hat role, Stine served as Vice President of Operations at APCT, where he helped guide operational strategy and performance.
In his new role as CTO, Stine will lead AdvancedPCB’s technology strategy and guide the company’s continued investment in advanced manufacturing capabilities. He will work closely with engineering and operations teams to strengthen technical infrastructure, expand capabilities, and support the company’s rapid growth across aerospace, defense, AI/data centers, medical, and other high-reliability markets.
“John’s journey with us has been nothing short of remarkable,” said Greg Halvorson, CEO of AdvancedPCB. “Over the years, he has demonstrated exceptional leadership, technical expertise, and a relentless commitment to driving innovation. His contributions have been instrumental in advancing our products and shaping the direction of our technology.”
“I’m honored to take on the role of Chief Technology Officer at a time when our customers are facing increasing technical complexity and faster development cycles," said John Stine, Chief Technology Officer for AdvancedPCB. "My focus is on strengthening the technical partnership with our customers so we can solve harder problems, accelerate development cycles, and deliver reliable PCB solutions for their most demanding applications.”
Stine is Lean Six Sigma certified and is recognized throughout the electronics manufacturing community for his extensive hands-on experience and practical approach to solving complex technical challenges.
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Rachael Temple - AlltematedSuggested Items
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
STI Electronics Announces New Recipients of the Jim D. Raby/STI Scholarship
04/22/2026 | STI Electronics Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, is proud to announce the latest recipients of the Jim D. Raby/STI Scholarship: Ashley Brito, Process Control Technology; June-Ann C. Richards-Owens, Advanced Manufacturing; and Jayden Deon Jones.
Technica Announces Tech Day Event Dates and Agenda
04/13/2026 | Technica USATechnica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.