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Zhen Ding Technology Holding Ltd. hosted its 2026 Global Partnership Conference and officially broke ground on the Smart Manufacturing Base at Avary's Shenzhen Campus III, reinforcing its strategy to expand high-end PCB production for artificial intelligence applications.
The event brought together global supply chain partners, government representatives, and industry experts to mark the start of construction and strengthen collaboration across the AI electronics ecosystem.
Chairman Charles Shen said AI is driving demand for increasingly complex printed circuit boards used in AI servers, high-speed optical modules, AI devices, and intelligent vehicles. As a result, demand is shifting toward higher-density, higher-layer-count, and more reliable PCB technologies.
The Shenzhen Campus III project represents a major investment in Zhen Ding's AI strategy. Planned with approximately 500,000 square meters of gross floor area and a total investment exceeding RMB10 billion, the facility will manufacture substrate-like PCBs for AI servers and optical modules, as well as advanced flexible PCBs for AI devices. The campus will also incorporate smart manufacturing, automation, and digital production management.
The company currently operates 28 production buildings, with 13 under construction and 16 in the planning stage. By 2030, Zhen Ding expects to have 57 production buildings in operation to support growing demand for advanced PCB products.
During the conference, executives discussed opportunities created by AI computing and heterogeneous integration, highlighting their impact on semiconductors, IC substrates, PCBs, smart manufacturing, and end applications. Zhen Ding also recognized supplier partners for achievements in ESG, quality, innovation, and service.
Shen noted that global PCB production value is expected to exceed $100 billion for the first time this year, marking the beginning of what he described as a "golden decade" for the PCB industry. He added that AI is increasing both PCB demand and performance requirements, making advanced PCB technologies critical to next-generation AI infrastructure.
Looking ahead, Zhen Ding said it will continue expanding its portfolio of flexible PCBs, HDI boards, high-layer-count PCBs, substrate-like PCBs, and IC substrates while strengthening partnerships across the global electronics supply chain to support AI applications spanning cloud, networking, and edge devices.
