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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Future Electronics, SnapMagic Announce CAD Model Integration to Support Faster Design Cycles
March 4, 2026 | SnapMagicEstimated reading time: 1 minute
Future Electronics, a leading global distributor of electronic components, and SnapMagic, a provider of CAD models and design enablement tools for electronic components, have announced the launch of integrated SnapMagic CAD models across the Future Electronics global online catalog. Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
The new integration brings over ten million CAD assets into the Future Electronics digital experience, allowing engineers to download models in formats compatible with leading ECAD tools without leaving the website. Each model is aligned with manufacturer specifications to support accuracy and consistency throughout early design stages.
“Providing engineers with immediate access to reliable CAD resources reinforces our commitment to supporting customers throughout the entire design journey,” said Georgia Genovezos, Corporate Vice President of Digital Marketing at Future Electronics. “By working closely with SnapMagic, we are delivering a seamless experience that connects component selection with practical design execution.”
SnapMagic brings its extensive CAD library and model generation expertise to the collaboration, expanding access to high quality design assets for engineers worldwide.
“Our goal is to remove friction from the design process by making CAD models easy to find and easy to use,” said Natasha Baker, CEO at SnapMagic. “Partnering with Future Electronics allows SnapMagic to support engineers as they are selecting components - without needing to change their existing workflows.”
This joint launch represents a shared focus on design enablement and reflects both companies’ continued investment in tools that help engineering teams move faster and design with confidence.
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Julia McCaffrey - NCAB GroupSuggested Items
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.