Indium to Feature High-Reliability Liquid Metal Technology at SEMI-THERM 2026

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Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12, in San Jose, California.

Indium Corporation will showcase the following products:

• Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability to both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
• Solder TIMs deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, TIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, TIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
• Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
• Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining.
• Phase-Change Metal Alloy (PCMA) TIMs are low-melting alloys, solid at room temperature, with a melting point as low as 30°C. They provide exceptional thermal conductivity and reliability for TIM1.5 applications, offering thermal performance similar to liquid metal. This allows for better volume control and efficient use in high-volume production. PCMA TIMs are available in Ga-based and Ga-free options.