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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
February 24, 2026 | GlobeNewswireEstimated reading time: 2 minutes
DesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the 2026 edition. The annual three-day event will feature Joseph Lukens, Associate Professor at Purdue University School of Electrical and Computer Engineering, Mark Ren, Founder at Agentrys; and Bhanu Sood, Chief Technologist at NASA Goddard Space Flight Center, each presenting key findings, research and innovations moving the sector forward through cutting-edge technologies and practical applications.
From Spooky Action at a Distance to the Quantum Internet
On day 1, Lukens will discuss the origins, triumphs, and opportunities of quantum networking, tracing its evolution from basic quantum theory, through the maturation of its first commercial application (quantum key distribution), and finally to the present explosion of entanglement-based testbeds throughout the globe. They keynote will feature technological successes to date as well as the variety of remaining challenges, present a vision for a “quantum information superhighway,” akin to the epoch-defining classical Internet and poised to revolutionize the ways in which information is measured, transmitted, and processed.
Agentic Artificial Intelligence for Chip Design
AI is poised to transform hardware design just as it has reshaped software, though with far greater difficulty due to limited training data and the depth of required domain knowledge. On day 2, Ren’s keynote will trace the evolution from simple agents that autonomously repair Register-Transfer-Level (RTL) syntax errors to multi-agent systems capable of generating full RTL designs directly from specifications.
Technology Innovations Driving NASA's Science and Exploration Goals
Closing out the keynote slate on day 3 is Sood with an in-depth look at electronics as the fundamentals to NASA’s ability to achieve its exploration and science objectives, alongside advanced electronic design to enable critical capabilities for missions to the moon, Mars, and beyond. This includes autonomous navigation, high-performance onboard computing, and miniaturized sensing for planetary science. The discussion will explore design challenges and highlight emerging trends in AI-enabled electronics, modular architectures, and photonic systems. These innovations are essential to supporting NASA’s priorities for sustainable lunar operations, Mars exploration, and scientific discovery across the solar system.
“DesignCon has always been a hub for innovation, and this year’s keynote lineup is a testament to the incredible advancements shaping the future of engineering and technology,” says Suzanne Deffree, VP and Group Portfolio Lead, Manufacturing by Informa. “From the exploration of agentic AI in chip design to insights into the quantum internet to space discovery and beyond, DesignCon’s keynotes will provide our attendees with a unique opportunity to learn from the brightest minds in the industry. These keynotes are not just about sharing knowledge, they are about sparking ideas, creating touchpoints for collaboration, and inspiring the next wave of breakthroughs in electronics design. There is no better place to bring together such a diverse and forward-thinking group of experts to lead the conversation than at DesignCon.”
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Julia McCaffrey - NCAB GroupSuggested Items
Sygaldry Raises $139M to Build Quantum Computers for AI
04/22/2026 | SygaldrySygaldry Technologies, Inc. announced that it has raised $139M in Series A and Seed financing to build quantum-accelerated AI servers.
IBM, UIUC Expand Discovery Accelerator for AI and Quantum Computing
04/20/2026 | PRNewswireIBM and the Grainger College of Engineering at the University of Illinois Urbana-Champaign (U. of I.) announced an expansion of the IBM-Illinois Discovery Accelerator Institute.
DARPA Launches HARQ Program to Integrate Diverse Qubits for Scalable Quantum Computing
04/20/2026 | DARPADARPA has launched the Heterogeneous Architectures for Quantum (HARQ) program, an effort aimed at overcoming one of the most persistent barriers in quantum computing: how to move beyond single-technology systems to achieve and scale practical, high-impact applications.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
IBM's David Lokken-Toyli: Quantum’s Call to ‘Leap’
04/10/2026 | Marcy LaRont, I-Connect007What happens when a cutting-edge quantum computer is placed in the middle of a public cafeteria? For David Lokken-Toyli, principal research scientist at IBM Quantum, that image, now a reality at Cleveland Clinic, captures a turning point: Quantum computing is moving out of the lab and into the real world, and getting there will depend not just on physicists, but on an electronics supply chain ready to support entirely new system requirements.