Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

The European PCB and Electronics Industries Score a Major Win in Chips 2.0 Milestone

06/15/2026 | Marcy LaRont, I-Connect007
Anyone who has spent time in the PCB industry knows the frustration: electronics policy discussions often begin and end with semiconductors. Yet chips don't function in a vacuum, and increasingly, policymakers are beginning to recognize that reality. In what many consider a landmark moment for the European electronics ecosystem, the proposed CHIPS Act 2.0 broadens its scope to include electronics manufacturing and explicitly identifies printed circuit boards as a strategic technology. I caught up with Alison James to talk about the significance of this milestone, the years of advocacy behind it, and what comes next as the legislation moves through the European Union's complex approval process.

SEMI 3D & Systems Summit to Highlight Heterogeneous Integration for Europe's Semiconductor Future

06/15/2026 | SEMI
The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration.

EIPC Summer Conference 2026: AI, Robots, and Historic Vilnius, Lithuania

06/15/2026 | Marcy LaRont, I-Connect007
Historic downtown Vilnius, Lithuania, hosted the sold-out EIPC Summer Conference, June 9–10, where 175 participants gathered at the AC Hotel, including representatives from the Global Electronics Association, FED, and four other industry associations. This year also included representation from 14 European PCB companies, and one—TTM— from the U.S., something that hasn’t happened for quite some time.

SEMI 3D & Systems Summit to Spotlight Heterogeneous Integration for Europe's Semiconductor Future

06/12/2026 | SEMI
The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration.

ICAPE Welcomes New Institutional Investor After 1.85% Stake Sale by Thierry Ballenghien

06/11/2026 | ICAPE Group
ICAPE Group announces that the Farringdon European Opportunities fund has acquired a stake in its capital.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in