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Keiron Printing Technologies Appoints BarTron as Midwest & Ohio Valley Sales Rep
January 29, 2026 | Keiron Printing TechnologiesEstimated reading time: 2 minutes
Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, announced that it has appointed BarTron, Inc. as its authorized sales representative for Michigan, Ohio, Western Pennsylvania, Indiana, and Kentucky. BarTron will support the introduction and regional adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest innovation, the Keiron HF2 LiFT Printer.
Founded in July 1989, BarTron, Inc. has built a strong reputation for helping manufacturers solve complex process and production challenges. Through close collaboration with customers and technology partners, BarTron plays a key role in evaluating, implementing, and supporting advanced manufacturing solutions across the electronics assembly industry.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of variability in the SMT process while directly addressing one of the leading causes of assembly defects: inconsistent solder paste application.
The HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ files. This allows manufacturers to adopt digital solder paste printing without changing materials or reworking existing workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes rather than hours—making the system well suited for high-mix and NPI-driven production environments.
A key differentiator of the HF2 printer is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit during the printing process. This built-in verification improves first-pass yield while reducing rework and scrap, without the need for a separate SPI system. The contactless architecture also eliminates common reliability issues associated with clogging, wear, and alignment drift found in traditional printing technologies.
“BarTron’s technical depth and customer-focused approach make them an ideal partner as we expand access to LiFT technology,” said Brian Duffey, President of Keiron Technologies USA. “Their ability to guide manufacturers through evaluation and adoption will be instrumental in bringing the HF2 printer into production environments across the region.”
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Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.