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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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What’s Next for Global Electronics: A 2026 Outlook from East Asia
January 23, 2026 | Sydney Xiao, Global Electronics Association East AsiaEstimated reading time: 1 minute
This is the latest entry in our ongoing blog series, where Global Electronics Association experts explore the forces shaping the future of the global electronics industry.
Today, we turn to insights from Sydney Xiao, President of the East Asia Region, who provides her predictions below.
RATIONALIZED INVESTMENT: Investment in 2026 is expected to become more disciplined, with companies placing greater emphasis on sustainable returns rather than aggressive expansion. This shift may help differentiate organizations with resilient, long-term business models from those driven primarily by short-term momentum.
AI CONVERGENCE ACROSS SECTORS: AI is evolving into a core capability across many product categories, supported by continued growth in edge AI chips. Automotive, industrial, and telecom systems are likely to further integrate AI functionalities, creating demand for more specialized processors and intelligent components.
ADVANCED SEMICONDUCTOR DEMAND: Demand for power semiconductors is expected to rise as EV and Advanced Driver Assistance Systems (ADAS) adoption continues to broaden. At the same time, increasing regional investment in advanced packaging technologies, including 2.5D and 3D ICs, is expected to further support the development of next-generation automotive and edge AI devices.
SECURITY AS A STRATEGIC FOUNDATION: Security across supply chains, product design, and data is likely to become a more central strategic priority. Regional cooperation may expand under clearer “secure and trusted” frameworks as governments seek to enhance predictability, transparency, and resilience through policy and incentive structures.
NEARSHORING AND FOOTPRINT OPTIMIZATION: Nearshoring is expected to play an increasingly important role in manufacturing strategies. While it often involves a higher upfront investment, it can help mitigate disruption risks, shorten supply cycles, and facilitate greater automation. When evaluated through total cost of ownership, nearshoring may emerge as a more competitive and strategically attractive option over time.
Looking Ahead
Companies that integrate AI capability, advanced semiconductor technologies, secure supply chains, and optimized manufacturing footprints will be better positioned to navigate volatility and capture sustainable growth in 2026 and the years ahead.
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Rachael Temple - AlltematedSuggested Items
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.