Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

5GAA Demonstrates Satellite, Safety and Cooperative Services in the Nordic Region

04/24/2026 | PRNewswire
The 5G Automotive Association (5GAA) showcased how connected mobility services can operate at scale, presenting live demonstrations of real-time road-work safety on a Swedish highway, satellite connectivity, safety, and cooperative sensing at the AstaZero Proving Ground at RISE in Sweden.

Advanced Materials Roundtable

04/23/2026 | I-Connect007 Editorial Team
Driven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelly.

Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation

04/22/2026 | PRNewswire
Flex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.

Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains

04/22/2026 | PRNewswire
Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in