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Dymax, a global manufacturer of light-curing adhesives and equipment, will exhibit at SMTA Guadalajara, October 7-8, booth 830, where visitors can discover light-curing solutions designed to help manufacturers improve efficiency, reliability, and process performance.

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The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.

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As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.
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