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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
January 7, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters.
Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
In his new column, Powering the Future, Brian takes readers inside that battle. Drawing on decades of experience in advanced materials and packaging, he’ll explore the technologies that make high-power electronics possible, from metalized ceramics and thick film circuits to advanced substrates and thermal interface materials.
Each month, Brian will explore how innovations in materials science—particularly in aluminum nitride, alumina, and metallized ceramics—are transforming power management, enabling higher efficiency, improved heat dissipation, and smaller, more reliable systems. He’ll look at the details of thermal design, thick-film metallization, and substrate engineering, showing how these hidden layers determine everything from device lifespan to performance at scale.
Whether it’s the next generation of EV inverters, high-frequency RF amplifiers, or medical laser drivers, Powering the Future will show how smarter material choices and better heat control are more than technical improvements; they’re competitive advantages.
Brian will write about the intersection of physics and innovation, where ceramics, films, and substrates become the building blocks of the technologies that will drive the next decade.
Look for Brian's new column to debut next week!
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ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
AI Revolutionizing Electronics Manufacturing with Burkle
04/23/2026 | Real Time with... APEX EXPOExplore the transformative impact of artificial intelligence on the electronics industry with Andy Turner, president and CEO of Burkle North America. Discover how AI is revolutionizing customer support, enhancing product development, and enabling scalable manufacturing solutions. Learn how Burkle leverages AI to optimize operations, improve customer satisfaction, and support entrepreneurs in achieving their business goals.
GreenSource Fabrication to Exhibit at PCB East 2026
04/23/2026 | GreenSource FabricationGreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
It’s Only Common Sense: Customers Capabilities—and Confidence
04/20/2026 | Dan Beaulieu -- Column: It's Only Common SenseI’ve been around, man! I’ve been in enough conference rooms, factory floors, and late-night airport lounges to know one thing for certain: Most companies think they lose business because they lack capability. They don’t. They lose business because they fail to inspire confidence.