Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

Powering the Future: Performance Is Won in Assembly

08/05/2026 | Brian Buyea -- Column: Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper—to how it performs in assembly. No matter how good your substrate is, if the assembly isn’t right, none of it matters. Engineers are coming to terms with the fact that performance is more than the circuit. It’s now about the system, and that’s where assembly stops being an afterthought and becomes the whole game.

Below the Surface: Ceramic vs. PCB—When ‘Good Enough’ Becomes System Failure

07/28/2026 | Chandra Gupta -- Column: Below the Surface
Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’

05/20/2026 | Brian Buyea -- Column: Powering the Future
There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will cost you performance and reliability; in some applications, it may cost you the entire design. Remtec builds are not “better PCBs,” but fundamentally different platforms. Here are eight “truths” to demonstrate that difference.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/20/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in