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TTCI Brings Manufacturing Test Expertise to Keysight UGM in Santa Clara

09/03/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that it will exhibit at the Keysight Technologies Manufacturing Test User Group Meeting (UGM) on September 16, 2026, in Santa Clara, California.

Marelli, Microchip Pioneer Open-Standard Display Connectivity for Software-Defined Vehicles

09/03/2026 | PRNewswire
Marelli, a global automotive supplier, and Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a new solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open standard for automotive video connectivity.

Designers Notebook: Implementing Strategic Planning Principles for PCB Design

09/03/2026 | Vern Solberg -- Column: Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).

Keysight Accelerates AttoTude IC Design Cycles by Over 50%

08/28/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.
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