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Revolutionizing PCB Manufacturing in the AI Era
December 22, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Artificial intelligence is reshaping every corner of the electronics ecosystem, and PCB manufacturing is under unprecedented pressure to evolve. In this exclusive conversation, Li Zhiqiang, general manager of Zhuhai Henger Microelectronics Equipment Co., Ltd., explains how plasma technology is emerging as a linchpin for next-generation AI hardware. As AI servers demand increasingly dense, high-performance PCBs, traditional chemical processes struggle to keep pace with new material systems and tighter reliability requirements. Li explains that Henger’s latest plasma etching and cleaning systems—engineered for precision, uniformity, and compatibility with advanced laminates—provide the process stability needed for the AI era.
Joined by Ms. Tang Ping, vice president of business development, they explore Henger’s rapid global expansion and its strategic push into automated, unmanned manufacturing. Their insights reveal a company positioning itself at the forefront of high-end, future-ready PCB production.
Marcy LaRont: Mr. Li and Ms. Ping, it is good to speak with you. Mr. Li, with the explosive growth of AI technologies, what new challenges is the PCB industry facing, and how are Henger’s solutions addressing these changes?
Li Zhiqiang: The rapid development of AI is imposing higher requirements on PCB manufacturing. AI servers, for example, are high-performance computing units that demand multilayer, high-density interconnect PCBs, which require strict control over dielectric properties and signal integrity. Traditional chemical etching techniques can no longer meet the precision and consistency required by the hardware being designed for many AI applications. Plasma technology, with its non-contact and highly uniform processing characteristics, is emerging as a key solution.
To continue reading this article, which originally appeared in the December 2025 edition of PCB007 Magazine, click here.
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