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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Global Electronics Association Invites Electronics Design Professionals to the 2nd Pan-European Electronics Design Conference (PEDC)
December 15, 2025 | Global Electronics AssociationEstimated reading time: 1 minute
The Global Electronics Association invites designers, engineers, researchers, and product‐development leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague.
Hosted by Fachverband Elektronikdesign und ‑fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community.
The conference connects the European electronics industry and the scientific community, exploring the latest developments in electronics design from “silicon to systems.” Topics include design for excellence (DfX), tools and workflows to bridge software and hardware design, and electronic systems design process for electronics assemblies.
What is PEDC 2026?
- A two-day programme of technical sessions and keynote panels covering the "silicon to systems" spectrum fully — from development and design tools to manufacturing and sustainability.
- Conference tracks span AI and software tools, DfX, sustainable design and product life cycle and package-PCB-system co-design.
- High-quality, peer-reviewed technical content and insights from European industry and academia.
- Knowledge accelerator through network with peers, experts, and global leaders.
Key Conference Highlights
- Opening special session: “AI in Product Development: Separating Hype from Reality” with industry leader Tomide Adesanmi, Circuit Mind; followed by a panel discussion featuring thought leaders from Altium, Cadence, Siemens and Zuken
- A dedicated track on sustainable design, materials and processes, addressing circularity and lifecycle optimization.
- Hands-on technical presentation featuring case studies in silicon-to-systems/package–PCB–co-design, showcasing advanced design integration strategies.
“With this newly formatted second PEDC, we want to build on the success of last year’s event,” said Peter Tranitz, senior director of technology solutions at the Global Electronics Association. “As with the first edition, a Europe-wide panel of experts will develop a high-quality technical programme that remains fully independent and free from commercial influence.”
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Julia McCaffrey - NCAB GroupSuggested Items
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.