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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Real Time with... productronica 2025: Pluritec Previews X-ray, Drilling and Wet Processing Automation
November 12, 2025 | Real Time with...productronicaEstimated reading time: Less than a minute
Nolan Johnson catches up with Maurizio Bonati for a sneak peek at Pluritec's productronica program, and also an update on business in general. Listen to the conversation now.
Stay tuned for more exclusive coverage of productronica 2025 after the big event next week on realtimewith.com and featured in upcoming I-Connect007 Newsletters. If you aren't already, be sure to subscribe to have all our coverage delivered directly to you inbox!
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Simon Khesin - Schmoll MaschinenSuggested Items
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Real Time with... APEX EXPO 2026: IPC Certification Trends With Blackfox
03/04/2026 | Real Time with... APEX EXPOJamie Noland of Blackfox Training discusses crucial trends in IPC certification. Noland highlights the demand for updated standards like IPC J-Standard 001 and WHMA A-620, especially within the aerospace sector. The conversation also addresses the importance of these certifications for demonstrating employee expertise and Blackfox's role in providing focused, effective training solutions.
Real Time with... APEX EXPO 2026: Exploring PCB Fabrication and Industry 4.0 Innovations with Burkle
02/23/2026 | Real Time with... APEX EXPONolan Johnson speaks with Andy Turner, CEO of Burkle North America, about PCB fabrication and pressing technologies. They discuss the significance of Industry 4.0, focusing on machine integration and data collection for improved manufacturing efficiency. The conversation covers Burkle's adoption of the Open Platform Communications Unified Architecture (OPC UA) protocol for better data sharing and the role of AI and automation in enhancing processes and customer interactions.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
01/05/2026 | I-Connect007Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.