Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Target Condition: When Design Outpaces Manufacturing
TI Names President and CEO Haviv Ilan as Chairman of the Board
October 20, 2025 | PRNewswireEstimated reading time: 1 minute
Texas Instruments Incorporated (TI) announced that its board of directors has elected President and Chief Executive Officer Haviv Ilan to take on the additional role as chairman, beginning January 2026. Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company.
Ilan has been a member of the board of directors since 2021 and TI's president and CEO since 2023. Prior to that, he was chief operating officer and held senior leadership positions across TI's analog and embedded processing businesses during his 26-year career at the company.
"Rich leaves an incredible legacy at TI and across the semiconductor industry. He has been a transformative leader, and we are grateful for Rich's vision, passion and wisdom that shaped TI to become the great company that it is today," said Janet Clark, lead director of the TI board and chair of the audit committee. "This is a well-planned transition, and TI is in excellent shape operationally, financially and strategically. Haviv's appointment to chairman reflects his strong track record as a strategic and operational leader and the board's confidence that he is the right person to further strengthen the company for the long term."
"On behalf of our entire company, I want to thank Rich for his steadfast dedication and contributions to TI," said Ilan. "Rich has been instrumental in driving TI's success, and his leadership will have an enduring impact on our company. He inspired a generation of leaders, and I'm honored to carry his legacy forward as we continue to execute our strategy, strengthen our competitive advantages and generate long-term value."
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Lockheed Martin Wins Navy Contract for PAC-3 MSE Aegis Integration
04/23/2026 | Lockheed MartinThe U.S. government announced a contract with Lockheed Martin for the development, integration and testing of PAC-3® Missile Segment Enhancement (MSE) into the Aegis Combat System.
Creative Materials Reinforces Quality with ITAR and ISO Recertifications
04/23/2026 | Creative Materials, Inc.Creative Materials, Inc. announces it has recently achieved International Traffic in Arms Regulations (ITAR) certification and successfully completed ISO 9001 and ISO 14001 recertification audits, strengthening the company’s ability to support customers operating in highly regulated, mission-critical aerospace, defense, and medical device industries.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation
04/22/2026 | PRNewswireFlex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.