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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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The Power Integrity Issue: Design007 Magazine October 2025
October 8, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Power integrity wasn’t a big problem for most PCB designers until the 2000s, when power-hungry chips and features likewise forced the industry to take notice. But as technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Our featured contributors include Heidi Barnes of Keysight Technologies, Istvan Novak of Samtec, Zach Caprai of Siemens EDA, and columnists John Watson, Barry Olney, Kelly Dack, and Vern Solberg. We have a column by Matt Stevenson, and another article in a series by Anaya Vardya. Beth Massey of MacDermid Alpha Electronics Solutions discusses various potting compounds that can help manage issues such as CTE mismatch in RF applications.
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Brent Fischthal - Koh YoungSuggested Items
Delta to Acquire Noda RF Technologies to Enhance its Power Solutions Portfolio for the Semiconductor Industry
10/30/2025 | PRNewswireDelta Electronics, Inc., a leader in power management and smart green solutions, today announced the acquisition of 90.23% stake of Japan's Noda RF Technologies Co., Ltd. (NRF) through its subsidiary Delta Electronics (Netherlands) B.V. for JPY 5,024 million (approximately NT$1,034 million).
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
10/28/2025 | John Watson -- Column: Elementary, Mr. WatsonIf electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.
Infineon to Purchase Long-Term Green Electricity from Wind Farms in Brandenburg, Germany and Solar Plants in Spain
10/27/2025 | InfineonInfineon Technologies AG has concluded Power Purchase Agreements (PPA) with PNE AG and Statkraft for green electricity.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/24/2025 | Andy Shaughnessy, I-Connect007This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.