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Federal Electronics Expands Selective Soldering Capabilities with Installation of Pillarhouse System
October 3, 2025 | Federal ElectronicsEstimated reading time: 1 minute
Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo, Mexico facility, further strengthening its ability to support high-mix, high-complexity assemblies. With one system now dedicated to lead solder and the other to lead-free, the site can better accommodate diverse customer requirements for high-mix, high-complexity assemblies.
The Jade MKII is designed for small- to medium-batch production, where precision, repeatability, and production flexibility are critical. The hand-load platform is equipped with a universally adjustable tooling carrier that accommodates PCBs or pallets up to 457mm x 508mm (18” x 20”). Pillarhouse’s patented Drop-Jet design fluxer provides fast, effective flushing of the pressurized flux chamber. This minimizes maintenance while supporting a range of flux types, including high solid content and water-soluble fluxes.
Federal Electronics’ Hermosillo facility plays a central role in the company’s North American manufacturing network, providing proximity to key customers, a highly skilled workforce, and infrastructure tailored to high-reliability markets. The addition of these selective solder systems was driven by the need to increase throughput while maintaining the company’s strict quality standards.
“Selective soldering is an important part of our capability set, especially for customers with high-reliability requirements,” said Ed Evangelista, President of Federal Electronics. “With these installations, we’re enhancing both flexibility and process control, ensuring that we can meet customer needs efficiently and consistently.”
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.