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Understanding Signal Integrity, the Foundation of High-Speed Digital Design
September 25, 2025 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute
Signal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.
Several decades ago, signal speeds were very slow (compared to today’s signal speed). Signal integrity (SI) didn’t seem to be a high priority, and balanced PCB structures, impedance requirements, routing techniques such as microstrip and stripline, were not a major requirement or focus to address. We could and were getting by with simply “making the point-to-point connections” without much thought, regarding the performance of a PCB when routing our signal traces. Well, those days are long gone.
This article will address the core concepts of understanding SI and why it’s important, with a focus on transmission lines, impedance discontinuities, reflections, and termination techniques—the foundation of reliable high-speed digital design.
The Basics of Transmission Lines
A transmission line is more than just a simple conductor. It’s a sophisticated structure that carries electromagnetic energy from one point to another. You know how a regular wire just carries electricity? Well, a transmission line is actually a bit more sophisticated than that. It's a special kind of pathway designed to move electromagnetic energy from one point to another.
To continue reading this article, which originally appeared in the September 2025 issue of Design007 Magazine, click here.
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Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Beyond Design: The Fundamental Structure of Spectral Integrity
10/21/2025 | Barry Olney -- Column: Beyond DesignImpedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Signal Integrity: A Game of Margins
09/25/2025 | Andy Shaughnessy, Design007 MagazineAs the founder of Wild River Technology, Al Neves deals with some of the most challenging aspects of signal integrity. Wild River’s engineers consult with high-tech companies that work at very high speeds and frequencies, often above 100G. Al is always a fun interview, so we asked him to share his thoughts on the current state of signal integrity engineering.
Beyond Design: Slaying Signal Integrity Villains
09/17/2025 | Barry Olney -- Column: Beyond DesignHigh-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.