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Suggested Items

Designers Notebook: Power and Ground Distribution Basics

10/29/2025 | Vern Solberg -- Column: Designer's Notebook
The principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.

Beyond Design: The Fundamental Structure of Spectral Integrity

10/21/2025 | Barry Olney -- Column: Beyond Design
Impedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.

Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity

10/01/2025 | John Watson -- Column: Elementary, Mr. Watson
For the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.

Signal Integrity: A Game of Margins

09/25/2025 | Andy Shaughnessy, Design007 Magazine
As the founder of Wild River Technology, Al Neves deals with some of the most challenging aspects of signal integrity. Wild River’s engineers consult with high-tech companies that work at very high speeds and frequencies, often above 100G. Al is always a fun interview, so we asked him to share his thoughts on the current state of signal integrity engineering.

Beyond Design: Slaying Signal Integrity Villains

09/17/2025 | Barry Olney -- Column: Beyond Design
High-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.
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