Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

AI Server Demand Keeps Memory Prices Up in 3Q26, but Gains Moderate

07/03/2026 | TrendForce
TrendForce’s latest memory pricing survey reveals that the DRAM market will remain extremely tight in the third quarter of 2026.

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

07/02/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

DRAM Shortages Hit DDR2, Prices Set to Keep Rising in 3Q26

06/22/2026 | TrendForce
TrendForce’s latest research reveals that structural tightening in mature-node DRAM supply is forcing consumer DRAM buyers to adopt legacy memory products to secure larger supply allocations.

NVIDIA Trims Vera CPU Memory Config Amid LPDRAM Supply Constraints

06/10/2026 | TrendForce
NVIDIA has decided to halve the SOCAMM memory capacity of its next-generation Vera Rubin Superchip modules, according to TrendForce’s latest findings.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in