Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
Beyond Design: Effective Floor Planning Strategies
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
August 26, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and 2, will focus on the role of metal-based TIMs in addressing key challenges across TIM1, TIM1.5, and TIM2 interfaces, including the need to reduce thermal resistance, minimize voiding, and enhance mechanical reliability under thermal cycling. Metal TIMs provide high thermal conductivity, excellent structural stability, and reliable performance across a range of interface conditions, including warped or non-planar surfaces.
“As AI and HPC systems continue to advance, thermal management has become essential to support increasing power densities and packaging complexity,” said Foo. “By highlighting application insights and recent advancements, this presentation will provide a practical perspective on how metal TIMs are enabling next-generation AI and HPC packaging through more reliable, efficient thermal solutions.”
As assistant product manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.
Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.
The presentation will take place on Thursday, September 18, at 10:50 a.m.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Thermal Interface Materials – Transition to High-Performance Materials
08/18/2025 | IDTechExIDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G.
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
Kopin Announces $9 Million Follow-On Contract for Defense Thermal Imaging Assembly
08/14/2025 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, industrial, consumer and medical products, today announced the award of an approximate $9 million follow-on production contract in support of a custom thermal imaging assembly build for a major U.S. defense prime contractor.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.