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Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Solstice Advanced Materials to Acquire Element Solutions

07/07/2026 | Element Solutions Inc.
Solstice Advanced Materials and Element Solutions announced that they have entered into a definitive agreement for Solstice to acquire Element in a cash-and-stock transaction valued at approximately $14.5 billion, including the assumption of net debt.

Element Solutions Declares Q2 Dividend of $0.08 Per Share

05/22/2026 | Element Solutions Inc.
Element Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock.

Element Solutions Reports Record Quarterly Results and Increases 2026 Full Year Guidance

04/30/2026 | BUSINESS WIRE
Element Solutions Inc, a global and diversified specialty chemicals technology company, announced its financial results for the three months ended March 31, 2026.

Element Solutions Announces Board Leadership Transition

03/24/2026 | BUSINESS WIRE
Element Solutions Inc, a global and diversified specialty chemicals technology company, announced that Sir Martin E. Franklin, Executive Chairman of the Board, plans to step down from the Board and will not seek re-election at the upcoming 2026 Annual Meeting of Stockholders.
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