Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
Beyond Design: Effective Floor Planning Strategies
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
August 5, 2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechEstimated reading time: 1 minute
Editor’s note: The following technical paper, originally titled “Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology,” was first presented at IPC APEX EXPO 2025’s Technical Conference, with original work published within the conference proceedings.
The rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
The Critical Role of Electrolytic Copper Plating
Electrolytic copper plating is a key process in package substrate manufacturing, significantly impacting subsequent stages such as etching. A major challenge in electrolytic plating is ensuring uniform copper distribution across the entire panel, whether in areas with a high density of holes or more isolated sections. Such high hole-density regions are integral to modern multilayer board (MLB) designs, despite introducing several manufacturing complexities. Traditional plating methods often result in inconsistent copper thickness across regions with varying hole densities, leading to discrepancies known as the “surface thickness gap.” This can lead to inconsistencies in etching and overall circuit performance. Moreover, achieving high throwing power is crucial to ensure sufficient copper is deposited within through-holes without excessive surface copper.
To continue reading this article, which originally appeared in the July 2025 issue of PCB007 Magazine, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
50% Copper Tariffs, 100% Chip Uncertainty, and a Truce
08/19/2025 | Andy Shaughnessy, I-Connect007If you’re like me, tariffs were not on your radar screen until a few months ago, but now political rhetoric has turned to presidential action. Tariffs are front-page news with major developments coming directly from the Oval Office. These are not typical times. President Donald Trump campaigned on tariff reform, and he’s now busy revamping America’s tariff policy.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.