Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
July 31, 2025 | Global Electronics AssociationEstimated reading time: 2 minutes
The Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
As CIO, Laufenberg will serve as a strategic partner to the CEO and executive leadership team, overseeing the implementation of a modern IT infrastructure and advancing the Association’s vision to become a data-informed and AI-accelerated global organization.
“Brent brings a rare combination of technical expertise, strategic vision, and deep understanding of how to use technology as a driver of business value,” said John W. Mitchell, Global Electronics Association president and CEO. “His leadership will be instrumental as we enter a new chapter focused on leveraging AI, data, and digital tools to serve our members in smarter, more personalized, and more impactful ways.”
Laufenberg’s priorities will include:
- Technology Strategy & Execution: Crafting and implementing a business-aligned technology roadmap that supports growth and delivers a competitive advantage for members.
- AI & Data Innovation: Championing AI adoption and building a data-driven culture to enhance decision-making, productivity, and insight.
- Member Experience Transformation: Leading the development of intuitive, personalized digital platforms that elevate member engagement and satisfaction.
- Organizational Enablement: Inspiring cross-functional collaboration and embedding technology as a strategic accelerator across the association.
- Security & Risk Management: Ensuring a secure, compliant, and resilient technology environment.
- Operational Efficiency: Managing IT investments and partnerships to deliver measurable value and performance.
“As the global electronics industry and supply chain continues to evolve, we have a responsibility to match that transformation in how we support our members,” Laufenberg said. “Every member experience—whether it’s training and certification, seamlessly leveraging our standards, gaining deeper industry insights, or creating new technology solutions to accelerate innovation—should be intuitive, personalized, and undeniably valuable. I’m excited to join the Global Electronics Association at such a pivotal time and look forward to helping expand the impact we can make through smart, strategic use of technology.”
Laufenberg joins the Association with more than two decades of technology leadership experience in complex, global organizations, most recently serving as chief technology officer at Rise, an omnichannel media agency. “Brent’s proven ability to lead digital transformation and his passion for innovation will be instrumental as the association continues to evolve to meet the needs of the global electronics industry,” added Mitchell.
Laufenberg works from the headquarters office in Bannockburn, Ill., and can be reached at BrentLaufenberg@electronics.org.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.