Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Seeing a Problem, Building a Solution: The ChipHub Story

06/05/2026 | Global Electronics Association
After more than three decades in the hardware industry, Aftab Farooqi knew one thing for certain: the way companies source semiconductors and components wasn’t working as well as it could. “I spent years at companies like Google and Amazon working in semiconductor sourcing,” he explains. “We were evaluating hundreds of thousands of components, with billions of dollars in spend, but the process was still incredibly manual and inefficient.”

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

06/04/2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?

Delta Thailand Included in S&P Global Sustainability Yearbook 2026

06/03/2026 | Delta Thailand
Delta Electronics (Thailand) Public Company Limited, a global leader in power management and smart green solutions, has been included in the S&P Global Sustainability Yearbook 2026 as a Sustainability Yearbook Member in the Electronic Equipment, Instruments & Components industry.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

Infineon Shifts Backend Production from Tijuana to Other Sites

06/03/2026 | Infineon
Infineon Technologies AG is realigning its manufacturing footprint in Mexico. The company will gradually transfer production from its site in Tijuana, Mexico, to other sites, strengthening overall scalability, productivity and competitiveness.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in