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ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey
July 31, 2025 |Estimated reading time: Less than a minute
ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.
The annual TechInsights Global Semiconductor Supplier Survey gathered over 28,000 responses from semiconductor manufacturers and subsystem users, covering more than 46 percent of the global chip market. Participants evaluated suppliers on criteria such as product quality, customer service, and performance.
“This recognition validates the trust our customers place in us and reflects our continued focus on innovation and service,” said Dr. Johann Weinhändler, Regional Head ASMPT Semiconductor Solutions Europe and CEO of ASMPT AMICRA in Regensburg, Germany. “Our goal is to support our clients as they navigate rapid advancements in AI, packaging, and process technologies.”
ASMPT was recognised for its innovative strength, strong customer relationships and adaptability in a volatile supply chain landscape, given the rapid technological advances in AI and advanced packaging. The ranking emphasises ASMPT's important role in driving the development of the semiconductor industry.
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Julia McCaffrey - NCAB GroupSuggested Items
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.