-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
July 29, 2025 | BUSINESS WIREEstimated reading time: 2 minutes
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments. Sales will start in August 2025. Targeting the rapidly growing New Space market, the new PCBs not only resolve the issue of heat management for high heat-generating components, but also enable space savings and weight reductions and reduce mounting man-hours because they are connector-less. OTC is targeting annual sales of 20 million yen in FY2026.
Rigid-flex PCBs have a structure that combines a thin, light, soft, and durable flexible circuit board (FPC, Note 1) made from insulating film, with a high-strength rigid PCB. This structure allows bending for installation in tight spaces inside equipment. Since no connectors are required to link the boards, these PCBs allow for space savings, weight reductions, and reductions in mounting man-hours. On the other hand, as the higher performance of components mounted on PCBs generates more heat, effective heat dissipation measures have become an issue in vacuum environments like space, where no convective heat dissipation occurs.
OTC has resolved this heat dissipation issue for rigid PCBs using its proprietary PCB technology with copper coin insertion whereby cylindrical-shaped copper coins with high thermal conductivity (Note 2) are inserted into PCB through-holes (Note 3) and bonded to heat-generating components to dissipate heat to the underside of the PCB. Applying this technology to rigid-flex PCBs has made it possible to create rigid-flex PCBs with embedded copper coins that demonstrate high heat dissipation performance in vacuum environments.
Having gained certification for all seven schedules of the JAXA (Japan Aerospace Exploration Agency) PCB standards, OTC offers strong expertise and highly reliable technologies for PCBs for use in space equipment. In addition, OTC can flexibly accommodate the small-lot production of PCBs to meet differing specification requirements according to the shape, size, and mounting location, allowing it to supply products for use at stages from development and prototyping to mass production. In its Medium-Term Business Plan 2025, OKI designates the aerospace market as a strategic focus for its EMS business. Drawing on its space-quality manufacturing capabilities, not only in design and production, but also simulations at the equipment design phase, OKI is working to expand technological development and sales in the global aerospace market.
OTC will exhibit at the Japan Booth of the Small Satellite Conference to be held from August 10 to August 13, 2025, at the Salt Palace Convention Center in Utah, USA, where it will showcase its rigid-flex PCBs with embedded copper coins.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Honeywell-Led Consortium Receives UK Government Funding to Revolutionize Aerospace Manufacturing
09/02/2025 | HoneywellA consortium led by Honeywell has received UK Government funding for a project that aims to revolutionize how critical aerospace technologies are manufactured in the UK through the use of AI and additive manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Boeing-built X-37B Spaceplane Launches, Beginning Eighth Mission
08/26/2025 | BoeingThe Boeing-built X 37B Orbital Test Vehicle launched its eighth mission, lifting off aboard a SpaceX Falcon 9 from Kennedy Space Center, Florida. The vehicle is healthy on orbit and proceeding with standard checkout.
TI Semiconductors Enable Advanced Earth-observation Capabilities of ISRO’s First-of-its-kind NISAR Mission
08/25/2025 | Texas InstrumentsTexas Instruments (TI) semiconductors are enabling the radar imaging and scientific exploration payloads for the NASA-Indian Space Research Organization (ISRO) synthetic aperture radar (NISAR) satellite, which was recently launched into orbit.
Rocket Lab Announces Expanded U.S. Investments for National Security Programs and Semiconductor Manufacturing
08/25/2025 | BUSINESS WIRERocket Lab Corporation, a global leader in launch services and space systems, announced it is boosting its U.S. investments to expand semiconductor manufacturing capacity and provide supply chain security for space-grade solar cells and electro-optical sensors for national security space missions.