-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
June 3, 2025 | IIT KharagpurEstimated reading time: 1 minute

In a landmark move to foster global collaboration in semiconductor research and talent development, IIT Kharagpur has signed a Memorandum of Understanding (MoU) with the Institute of Microelectronics (IME) under Singapore’s Agency for Science, Technology and Research (A*STAR). The announcement was made during SEMICON Southeast Asia 2025, where IIT Kharagpur represented India’s academic and technological prowess in the semiconductor domain.
This partnership underscores the shared commitment of India and Singapore to build a resilient, innovative, and skilled semiconductor ecosystem through international collaboration. IIT Kharagpur, India’s premier institution for science and technology, brings decades of expertise in microelectronics, chip design, nano-fabrication, and advanced materials, making it a key technical partner in this alliance.
As India scales its ambitions in semiconductor manufacturing and R&D, this collaboration positions IIT Kharagpur at the forefront of global initiatives aimed at strengthening semiconductor value chains. The MoU opens new avenues for joint research in Advanced CMOS and post-CMOS technologies; Heterogeneous integration and packaging; AI hardware accelerators; Next-generation memory systems; Photonics and quantum devices; Chip reliability, Thermal Management and Failure Analysis. The collaboration also supports exchange programmes for students and researchers, knowledge-sharing workshops, and co-development of training modules to develop future-ready semiconductor talent.
Prof. Anandaroop Bhattacharya, Dept. of Mechanical Engineering, IIT Kharagpur stated, “This MoU with A*STAR IME marks a significant step in IIT Kharagpur’s global ambition to drive semiconductor innovation. As India rapidly moves to become a semiconductor hub, academia-industry-government collaborations like this will be crucial in building a robust, self-reliant, and globally competitive semiconductor ecosystem.”
Prof. Yeo Yee Chia, Deputy Chief Executive (Innovation & Enterprise) at A*STAR commented, “Singapore's semiconductor ecosystem is built on strong collaborations between public agencies, academia, and industry partners. The Innovate Together event exemplifies our commitment to fostering these partnerships and accelerating innovation to address industry challenges and capture new opportunities in the global semiconductor landscape.”
The signing was part of A*STAR’s broader initiative to connect with international institutions, including partners from Uzbekistan and Singapore’s own semiconductor industry. The Innovate Together event held alongside SEMICON Southeast Asia 2025 highlighted the importance of cross-border collaborations in addressing complex challenges in semiconductor manufacturing, design, and integration.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.