Target Condition: From Dream House to Drill Files
Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
June 2, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
StikNPeel™ simplifies the process of selectively printing solder paste onto a printed circuit board. The process is as simple as peeling off the stencil backing, aligning in the proper location, and placing the stencil on the circuit board pad site. The StikNPeel™ stencil is secured in place on the PCB via a repositionable adhesive backing. Once properly placed, solder paste is dispensed across the stencil to obtain sufficient solder paste deposition. Next, the StikNPeel™ stencil is peeled off the circuit board leaving uniform solder paste volume in the aperture areas without any remaining residues or visible signs of rework. Once the stencil is removed, you’re ready for component placement.
Using StikNPeel™ stencils streamlines component placement without the common issues and mess that come with using metal stencils. The flexible material and adhesive backing ensure the board and stencil remain coplanar, preventing solder paste smearing and improving first-pass yields. Once aligned and pressed into place, the stencil remains adhered to the board providing uniform solder paste distribution. Utilizing this process eliminates the need for time-consuming masking around the rework area. Additionally, the StikNPeel™ stencil can be equipped with peripheral flaps to allow tighter positioning when navigating neighboring devices. Compared to our stay-in-place stencils, StikNPeel™ is removed from the board prior to component placement and leaves no visible evidence of rework.
StikNPeel™ rework stencils are custom made to your exact device requirements without the need for expensive tooling. One pack consists of 10 stencils in a pink anti-static bag. No minimum order requirements apply. Typical lead time is 3-5 days for up to 4 packs after check plot approval. Approved files include Gerber, DXF, or component mechanical specs.
Share on:
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
KYZEN to Spotlight Stencil Cleaning Solutions at SMTA Oregon
05/02/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place on Tuesday, May 20 at the Wingspan Event and Conference Center in Hillsboro, OR. KYZEN’s cleaning expert Jeff Deering will be on-site at the expo providing information about stencil cleaning chemistries, including KYZEN E5631J.
KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form
04/28/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.
KYZEN Focuses on Aqueous Cleaning and Stencil Cleaning at SMTA Wisconsin
04/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wisconsin Expo and Tech Forum, scheduled to take place Tuesday, May 6 at the Crowne Plaza Milwaukee Airport. KYZEN will be on-site to provide attendees with information about aqueous cleaning chemistry AQUANOX A4618 and stencil cleaner KYZEN E5631J.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.